Gold plating specification:
- Type 1, with 99.7 % gold minimum, hardness grade A, B or C. Gold plating used for general purpose, high reliability electrical contacts, solderability, and wire wrap connection.
- Type II, 99.0 % gold minimum; hardness grade B, C or D, A general purpose, wear resistant gold. But this equipment will not withstand to high temperature applications because the hardening agent in the gold plating will oxidize.
- Type III, with 99.9 % gold minimum; hardness grade A only. Gold plating for semiconductor components nuclear engineering, thermo-compression bonding, and high temperature application.
Any deposit of impurities can make difficult to solder, and for this reason high purity gold plating is preferred. Soldering requirements are best achieved when gold electroplating coating range between 0.00005 and 0.0001 inch (50 and 100 micro inches) thickness.
Gold Plating and Gold Electroplating hardness grades:
1. 90 knoop, maximum
2. 91 – 129 knoop, inclusive
3. 130 – 200 knoop, inclusive
4. 201 knoop, minimum